Under certain mode of operations, HLOS may be able get direct or indirect access through DXE channels to tamper with the authenticated WCNSS firmware stored in DDR because DXE-accessible memory is located within the authenticated image in Snapdragon Mobile and Snapdragon Wear in version MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617.
Conclusion & alert: CVE-2017-18313 is rated Low Risk (27.2/100): CVSS Medium severity, with low exploitation likelihood (EPSS 0.26%). Mandatory action: Monitor for updates and reassess as exploit intelligence or EPSS changes.
Risk is dynamic; we continuously reassess and refresh what is shown on this page as upstream context changes.
EPSS lead: Daily EPSS estimates relative likelihood of exploitation; percentile ranks this CVE among scored vulnerabilities (higher = more severe relative rank).
| # | Date | Old EPSS score | New EPSS score | Delta (New - Old) |
|---|---|---|---|---|
| 1 | 2026-06-15 | 0.15% | 0.26% | +0.11% |
| 2 | 2025-12-29 | 0.06% | 0.15% | +0.09% |
| 3 | 2023-03-07 | — | 0.06% | — |
Full EPSS history (5 records total)
CVSS metrics for this CVE.
| Base score | Version | Severity | Vector | Exploitability | Impact | Score source |
|---|---|---|---|---|---|---|
| 5.3 | 3.0 | MEDIUM |
|
1.6 | 3.6 | [email protected] |
| 5.7 | 2.0 | MEDIUM |
|
5.5 | 6.9 | [email protected] |
| Vendor | Product | Version | Raw CPE |
|---|---|---|---|
| qualcomm | msm8909w_firmware | — | cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_210_firmware | — | cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_212_firmware | — | cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_205_firmware | — | cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_410_firmware | — | cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_412_firmware | — | cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_615_firmware | — | cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_616_firmware | — | cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_415_firmware | — | cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_617_firmware | — | cpe:2.3:o:qualcomm:sd_617_firmware:-:*:*:*:*:*:*:* |
| URL | Tags |
|---|---|
| https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components | Third Party Advisory |
| https://www.qualcomm.com/company/product-security/bulletins | Vendor Advisory |