CVE-2017-18329

Possible Buffer overflow when transmitting an RTP packet in snapdragon automobile and snapdragon wear in versions MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 810, SD 820, SD 835, SD 845 / SD 850, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130

Published: 2019-01-03 Last update: 2026-06-16 Assigner: [email protected] Source: [email protected]

Conclusion & alert: CVE-2017-18329 is rated Low Risk (36.6/100): CVSS High severity, with low exploitation likelihood (EPSS 0.24%). Mandatory action: Monitor for updates and reassess as exploit intelligence or EPSS changes.

Risk is dynamic; we continuously reassess and refresh what is shown on this page as upstream context changes.

Exploit prediction scoring system (EPSS) score for CVE-2017-18329

EPSS lead: Daily EPSS estimates relative likelihood of exploitation; percentile ranks this CVE among scored vulnerabilities (higher = more severe relative rank).

# Date Old EPSS score New EPSS score Delta (New - Old)
1 2026-06-15 0.04% 0.24% +0.20%
2 2025-03-30 0.08% 0.04% -0.04%
3 2025-03-29 0.08%

Full EPSS history (6 records total)

Common vulnerability scoring system (CVSS) metrics for CVE-2017-18329

CVSS metrics for this CVE.

Base score Version Severity Vector Exploitability Impact Score source
7.8 3.0 HIGH
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H Click to expand
Attack vector (AV:L)
They already need access on the box, or another person has to do something wrong; it’s not a remote drive-by.
Attack complexity (AC:L)
Once they can reach the bug, pulling it off is straightforward—no weird race conditions or rare setup.
Privileges required (PR:L)
A normal user session is enough; they don’t have to be admin.
User interaction (UI:N)
Nobody has to click “OK” or open a trap file; it can work without a victim helping.
Scope (S:U)
Damage stays in the same “trust bubble” as the broken component—no big spill into unrelated systems.
Confidentiality (C:H)
Serious risk that confidential data gets exposed in a big way.
Integrity (I:H)
They could widely tamper with or forge data—trust in the data is badly hurt.
Availability (A:H)
Could take the service down hard or make it unusable for people who depend on it.
1.8 5.9 [email protected]
7.2 2.0 HIGH
AV:L/AC:L/Au:N/C:C/I:C/A:C Click to expand
Access vector (AV:L)
Requires local access to the target system.
Access complexity (AC:L)
Exploitation conditions are straightforward and predictable.
Authentication (AU:N)
No authentication is required.
Confidentiality impact (C:C)
Complete confidentiality impact.
Integrity impact (I:C)
Complete integrity impact.
Availability impact (A:C)
Complete availability impact.
3.9 10.0 [email protected]

Weakness enumeration for CVE-2017-18329

Affected software / configurations for CVE-2017-18329

Vendor Product Version Raw CPE
qualcomm mdm9615_firmware cpe:2.3:o:qualcomm:mdm9615_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9625_firmware cpe:2.3:o:qualcomm:mdm9625_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9635m_firmware cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9640_firmware cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9645_firmware cpe:2.3:o:qualcomm:mdm9645_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9650_firmware cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9655_firmware cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
qualcomm msm8909w_firmware cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
qualcomm msm8996au_firmware cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
qualcomm sd_210_firmware cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
qualcomm sd_212_firmware cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
qualcomm sd_205_firmware cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
qualcomm sd_425_firmware cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
qualcomm sd_427_firmware cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
qualcomm sd_430_firmware cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
qualcomm sd_435_firmware cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
qualcomm sd_450_firmware cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
qualcomm sd_615_firmware cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*
qualcomm sd_616_firmware cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*
qualcomm sd_415_firmware cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*
qualcomm sd_625_firmware cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
qualcomm sd_636_firmware cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*
qualcomm sd_650_firmware cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*
qualcomm sd_652_firmware cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*
qualcomm sd_712_firmware cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:*
qualcomm sd_710_firmware cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:*
qualcomm sd_670_firmware cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:*
qualcomm sd_810_firmware cpe:2.3:o:qualcomm:sd_810_firmware:-:*:*:*:*:*:*:*
qualcomm sd_820_firmware cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
qualcomm sd_835_firmware cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
qualcomm sd_845_firmware cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
qualcomm sd_850_firmware cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*
qualcomm sda660_firmware cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
qualcomm sdm630_firmware cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
qualcomm sdm660_firmware cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
qualcomm snapdragon_high_med_2016_firmware cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:*
qualcomm sxr1130_firmware cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*

References for CVE-2017-18329

cvelogic Threat Intelligence