CVE-2018-11259

Due to Improper Access Control of NAND-based EFS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, From fastboot on a NAND-based device, the EFS partition can be erased. Apps processor then has non-secure world full read/write access to the partition until the modem boots and configures the EFS partition addresses in its MPU partition.

Published: 2018-07-06 Last update: 2026-06-16 Assigner: [email protected] Source: [email protected]
NVD Status：Modified，CVE State: published
View at NVD, CVE.org, EUVD

CVE-2018-11259 is rated Low Risk (34.2/100): CVSS High severity, with low exploitation likelihood (EPSS 0.20%). Monitor for updates and reassess as exploit intelligence or EPSS changes.

Risk is dynamic; we continuously reassess and refresh what is shown on this page as upstream context changes.

Exploit prediction scoring system (EPSS) score for CVE-2018-11259

EPSS lead: Daily EPSS estimates relative likelihood of exploitation; percentile ranks this CVE among scored vulnerabilities (higher = more severe relative rank).

# Date Old EPSS score New EPSS score Delta (New - Old)
1 2026-06-15 0.09% 0.20% +0.11%
2 2026-01-01 0.04% 0.09% +0.05%
3 2025-03-30 — 0.04% —

Full EPSS history (8 records total)

Common vulnerability scoring system (CVSS) metrics for CVE-2018-11259

CVSS metrics for this CVE.

Base score Version Severity Vector Exploitability Impact Score source
7.7 3.0 HIGH
CVSS:3.0/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:N Click to expand
Attack vector (AV:L)
They already need access on the box, or another person has to do something wrong; it’s not a remote drive-by.
Attack complexity (AC:L)
Once they can reach the bug, pulling it off is straightforward—no weird race conditions or rare setup.
Privileges required (PR:N)
No account or special rights needed—anonymous or random user is enough.
User interaction (UI:N)
Nobody has to click “OK” or open a trap file; it can work without a victim helping.
Scope (S:U)
Damage stays in the same “trust bubble” as the broken component—no big spill into unrelated systems.
Confidentiality (C:H)
Serious risk that confidential data gets exposed in a big way.
Integrity (I:H)
They could widely tamper with or forge data—trust in the data is badly hurt.
Availability (A:N)
Service keeps running; no real outage angle.
 2.5 5.2 [email protected]
3.6 2.0 LOW
AV:L/AC:L/Au:N/C:P/I:P/A:N Click to expand
Access vector (AV:L)
Requires local access to the target system.
Access complexity (AC:L)
Exploitation conditions are straightforward and predictable.
Authentication (AU:N)
No authentication is required.
Confidentiality impact (C:P)
Partial confidentiality impact.
Integrity impact (I:P)
Partial integrity impact.
Availability impact (A:N)
No availability impact.
 3.9 4.9 [email protected]

Weakness enumeration for CVE-2018-11259

Affected software / configurations for CVE-2018-11259

Vendor Product Version Raw CPE
qualcomm mdm9206_firmware — cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9607_firmware — cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9635m_firmware — cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9640_firmware — cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9650_firmware — cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9655_firmware — cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
qualcomm msm8909w_firmware — cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
qualcomm msm8996au_firmware — cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
qualcomm sd_210_firmware — cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
qualcomm sd_212_firmware — cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
qualcomm sd_205_firmware — cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
qualcomm sd_410_firmware — cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*
qualcomm sd_412_firmware — cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*
qualcomm sd_425_firmware — cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
qualcomm sd_427_firmware — cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
qualcomm sd_430_firmware — cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
qualcomm sd_435_firmware — cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
qualcomm sd_450_firmware — cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
qualcomm sd_615_firmware — cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*
qualcomm sd_616_firmware — cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*
qualcomm sd_415_firmware — cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*
qualcomm sd_617_firmware — cpe:2.3:o:qualcomm:sd_617_firmware:-:*:*:*:*:*:*:*
qualcomm sd_625_firmware — cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
qualcomm sd_650_firmware — cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*
qualcomm sd_652_firmware — cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*
qualcomm sd_800_firmware — cpe:2.3:o:qualcomm:sd_800_firmware:-:*:*:*:*:*:*:*
qualcomm sd_810_firmware — cpe:2.3:o:qualcomm:sd_810_firmware:-:*:*:*:*:*:*:*
qualcomm sd_820_firmware — cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
qualcomm sd_820a_firmware — cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*
qualcomm sd_835_firmware — cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
qualcomm sd_845_firmware — cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
qualcomm sd_850_firmware — cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*
qualcomm sdm630_firmware — cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
qualcomm sdm632_firmware — cpe:2.3:o:qualcomm:sdm632_firmware:-:*:*:*:*:*:*:*
qualcomm sdm636_firmware — cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*
qualcomm sdm660_firmware — cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
qualcomm sdx20_firmware — cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:*
qualcomm snapdragon_high_med_2016_firmware — cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:*

References for CVE-2018-11259

cvelogic Threat Intelligence