CVE-2018-11267

In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20.

Published: 2018-09-20 Last update: 2024-11-21 Assigner: [email protected] Source: [email protected]

Conclusion & alert: CVE-2018-11267 is rated Low Risk (34/100): CVSS High severity, with low exploitation likelihood (EPSS 0.04%). Mandatory action: Monitor for updates and reassess as exploit intelligence or EPSS changes.

Risk is dynamic; we continuously reassess and refresh what is shown on this page as upstream context changes.

Exploit prediction scoring system (EPSS) score for CVE-2018-11267

EPSS lead: Daily EPSS estimates relative likelihood of exploitation; percentile ranks this CVE among scored vulnerabilities (higher = more severe relative rank).

# Date Old EPSS score New EPSS score Delta (New - Old)
1 2025-03-30 0.07% 0.04% -0.04%
2 2025-03-29 0.04% 0.07% +0.03%
3 2023-03-07 0.04%

Full EPSS history (5 records total)

Common vulnerability scoring system (CVSS) metrics for CVE-2018-11267

CVSS metrics for this CVE.

Base score Version Severity Vector Exploitability Impact Score source
7.8 3.0 HIGH
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H Click to expand
Attack vector (AV:L)
They already need access on the box, or another person has to do something wrong; it’s not a remote drive-by.
Attack complexity (AC:L)
Once they can reach the bug, pulling it off is straightforward—no weird race conditions or rare setup.
Privileges required (PR:L)
A normal user session is enough; they don’t have to be admin.
User interaction (UI:N)
Nobody has to click “OK” or open a trap file; it can work without a victim helping.
Scope (S:U)
Damage stays in the same “trust bubble” as the broken component—no big spill into unrelated systems.
Confidentiality (C:H)
Serious risk that confidential data gets exposed in a big way.
Integrity (I:H)
They could widely tamper with or forge data—trust in the data is badly hurt.
Availability (A:H)
Could take the service down hard or make it unusable for people who depend on it.
1.8 5.9 [email protected]
7.2 2.0 HIGH
AV:L/AC:L/Au:N/C:C/I:C/A:C Click to expand
Access vector (AV:L)
Requires local access to the target system.
Access complexity (AC:L)
Exploitation conditions are straightforward and predictable.
Authentication (AU:N)
No authentication is required.
Confidentiality impact (C:C)
Complete confidentiality impact.
Integrity impact (I:C)
Complete integrity impact.
Availability impact (A:C)
Complete availability impact.
3.9 10.0 [email protected]

Weakness enumeration for CVE-2018-11267

Affected software / configurations for CVE-2018-11267

Vendor Product Version Raw CPE
qualcomm mdm9206_firmware cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9607_firmware cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9615_firmware cpe:2.3:o:qualcomm:mdm9615_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9640_firmware cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9650_firmware cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9655_firmware cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
qualcomm msm8996au_firmware cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
qualcomm sd210_firmware cpe:2.3:o:qualcomm:sd210_firmware:-:*:*:*:*:*:*:*
qualcomm sd212_firmware cpe:2.3:o:qualcomm:sd212_firmware:-:*:*:*:*:*:*:*
qualcomm sd205_firmware cpe:2.3:o:qualcomm:sd205_firmware:-:*:*:*:*:*:*:*
qualcomm sd410_firmware cpe:2.3:o:qualcomm:sd410_firmware:-:*:*:*:*:*:*:*
qualcomm sd412_firmware cpe:2.3:o:qualcomm:sd412_firmware:-:*:*:*:*:*:*:*
qualcomm sd425_firmware cpe:2.3:o:qualcomm:sd425_firmware:-:*:*:*:*:*:*:*
qualcomm sd427_firmware cpe:2.3:o:qualcomm:sd427_firmware:-:*:*:*:*:*:*:*
qualcomm sd430_firmware cpe:2.3:o:qualcomm:sd430_firmware:-:*:*:*:*:*:*:*
qualcomm sd435_firmware cpe:2.3:o:qualcomm:sd435_firmware:-:*:*:*:*:*:*:*
qualcomm sd450_firmware cpe:2.3:o:qualcomm:sd450_firmware:-:*:*:*:*:*:*:*
qualcomm sd600_firmware cpe:2.3:o:qualcomm:sd600_firmware:-:*:*:*:*:*:*:*
qualcomm sd615_firmware cpe:2.3:o:qualcomm:sd615_firmware:-:*:*:*:*:*:*:*
qualcomm sd616_firmware cpe:2.3:o:qualcomm:sd616_firmware:-:*:*:*:*:*:*:*
qualcomm sd415_firmware cpe:2.3:o:qualcomm:sd415_firmware:-:*:*:*:*:*:*:*
qualcomm sd617_firmware cpe:2.3:o:qualcomm:sd617_firmware:-:*:*:*:*:*:*:*
qualcomm sd625_firmware cpe:2.3:o:qualcomm:sd625_firmware:-:*:*:*:*:*:*:*
qualcomm sd650_firmware cpe:2.3:o:qualcomm:sd650_firmware:-:*:*:*:*:*:*:*
qualcomm sd652_firmware cpe:2.3:o:qualcomm:sd652_firmware:-:*:*:*:*:*:*:*
qualcomm sd820_firmware cpe:2.3:o:qualcomm:sd820_firmware:-:*:*:*:*:*:*:*
qualcomm sd820a_firmware cpe:2.3:o:qualcomm:sd820a_firmware:-:*:*:*:*:*:*:*
qualcomm sd835_firmware cpe:2.3:o:qualcomm:sd835_firmware:-:*:*:*:*:*:*:*
qualcomm sd845_firmware cpe:2.3:o:qualcomm:sd845_firmware:-:*:*:*:*:*:*:*
qualcomm sd850_firmware cpe:2.3:o:qualcomm:sd850_firmware:-:*:*:*:*:*:*:*
qualcomm sda660_firmware cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
qualcomm sdm429_firmware cpe:2.3:o:qualcomm:sdm429_firmware:-:*:*:*:*:*:*:*
qualcomm sdm439_firmware cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
qualcomm sdm630_firmware cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
qualcomm sdm632_firmware cpe:2.3:o:qualcomm:sdm632_firmware:-:*:*:*:*:*:*:*
qualcomm sdm636_firmware cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*
qualcomm sdm660_firmware cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
qualcomm sdx20_firmware cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:*
qualcomm snapdragon_high_med_2016_firmware cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:*

References for CVE-2018-11267

cvelogic Threat Intelligence