In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
Conclusion & alert: CVE-2018-11277 is rated Low Risk (33.7/100): CVSS High severity, with low exploitation likelihood (EPSS 0.17%). Mandatory action: Monitor for updates and reassess as exploit intelligence or EPSS changes.
Risk is dynamic; we continuously reassess and refresh what is shown on this page as upstream context changes.
EPSS lead: Daily EPSS estimates relative likelihood of exploitation; percentile ranks this CVE among scored vulnerabilities (higher = more severe relative rank).
| # | Date | Old EPSS score | New EPSS score | Delta (New - Old) |
|---|---|---|---|---|
| 1 | 2026-06-15 | 0.04% | 0.17% | +0.13% |
| 2 | 2025-03-30 | 0.07% | 0.04% | -0.03% |
| 3 | 2025-03-29 | — | 0.07% | — |
Full EPSS history (6 records total)
CVSS metrics for this CVE.
| Base score | Version | Severity | Vector | Exploitability | Impact | Score source |
|---|---|---|---|---|---|---|
| 7.8 | 3.0 | HIGH |
|
1.8 | 5.9 | [email protected] |
| 4.6 | 2.0 | MEDIUM |
|
3.9 | 6.4 | [email protected] |
| Vendor | Product | Version | Raw CPE |
|---|---|---|---|
| qualcomm | msm8909w_firmware | — | cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:* |
| qualcomm | msm8996au_firmware | — | cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd210_firmware | — | cpe:2.3:o:qualcomm:sd210_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd212_firmware | — | cpe:2.3:o:qualcomm:sd212_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd205_firmware | — | cpe:2.3:o:qualcomm:sd205_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd430_firmware | — | cpe:2.3:o:qualcomm:sd430_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd450_firmware | — | cpe:2.3:o:qualcomm:sd450_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd615_firmware | — | cpe:2.3:o:qualcomm:sd615_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd616_firmware | — | cpe:2.3:o:qualcomm:sd616_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd415_firmware | — | cpe:2.3:o:qualcomm:sd415_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd617_firmware | — | cpe:2.3:o:qualcomm:sd617_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd625_firmware | — | cpe:2.3:o:qualcomm:sd625_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd650_firmware | — | cpe:2.3:o:qualcomm:sd650_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd652_firmware | — | cpe:2.3:o:qualcomm:sd652_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd810_firmware | — | cpe:2.3:o:qualcomm:sd810_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd820_firmware | — | cpe:2.3:o:qualcomm:sd820_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd820a_firmware | — | cpe:2.3:o:qualcomm:sd820a_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd835_firmware | — | cpe:2.3:o:qualcomm:sd835_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd845_firmware | — | cpe:2.3:o:qualcomm:sd845_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sda660_firmware | — | cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:* |
| URL | Tags |
|---|---|
| https://www.qualcomm.com/company/product-security/bulletins | Vendor Advisory |