CVE-2018-13906

The HMAC authenticating the message from QSEE is vulnerable to timing side channel analysis leading to potentially forged application message in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in IPQ4019, IPQ8074, MDM9150, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCA8081, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, SDX20, Snapdragon_High_Med_2016, SXR1130

Published: 2019-06-14 Last update: 2024-11-21 Assigner: [email protected] Source: [email protected]

Conclusion & alert: CVE-2018-13906 is rated Moderate Risk (53.2/100): CVSS Critical severity, with low exploitation likelihood (EPSS 0.66%). Mandatory action: Review affected assets and schedule remediation.

Risk is dynamic; we continuously reassess and refresh what is shown on this page as upstream context changes.

Exploit prediction scoring system (EPSS) score for CVE-2018-13906

EPSS lead: Daily EPSS estimates relative likelihood of exploitation; percentile ranks this CVE among scored vulnerabilities (higher = more severe relative rank).

# Date Old EPSS score New EPSS score Delta (New - Old)
1 2026-06-15 0.23% 0.66% +0.43%
2 2025-03-30 0.45% 0.23% -0.22%
3 2025-03-29 0.45%

Full EPSS history (7 records total)

Common vulnerability scoring system (CVSS) metrics for CVE-2018-13906

CVSS metrics for this CVE.

Base score Version Severity Vector Exploitability Impact Score source
9.1 3.0 CRITICAL
CVSS:3.0/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:N Click to expand
Attack vector (AV:N)
Could be attacked over the internet or any normal routed network—not just someone sitting at the machine.
Attack complexity (AC:L)
Once they can reach the bug, pulling it off is straightforward—no weird race conditions or rare setup.
Privileges required (PR:N)
No account or special rights needed—anonymous or random user is enough.
User interaction (UI:N)
Nobody has to click “OK” or open a trap file; it can work without a victim helping.
Scope (S:U)
Damage stays in the same “trust bubble” as the broken component—no big spill into unrelated systems.
Confidentiality (C:H)
Serious risk that confidential data gets exposed in a big way.
Integrity (I:H)
They could widely tamper with or forge data—trust in the data is badly hurt.
Availability (A:N)
Service keeps running; no real outage angle.
3.9 5.2 [email protected]
6.4 2.0 MEDIUM
AV:N/AC:L/Au:N/C:P/I:P/A:N Click to expand
Access vector (AV:N)
Can be exploited remotely over network reachability.
Access complexity (AC:L)
Exploitation conditions are straightforward and predictable.
Authentication (AU:N)
No authentication is required.
Confidentiality impact (C:P)
Partial confidentiality impact.
Integrity impact (I:P)
Partial integrity impact.
Availability impact (A:N)
No availability impact.
10.0 4.9 [email protected]

Weakness enumeration for CVE-2018-13906

Affected software / configurations for CVE-2018-13906

Vendor Product Version Raw CPE
qualcomm ipq4019_firmware cpe:2.3:o:qualcomm:ipq4019_firmware:-:*:*:*:*:*:*:*
qualcomm ipq8074_firmware cpe:2.3:o:qualcomm:ipq8074_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9150_firmware cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9206_firmware cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9607_firmware cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9635m_firmware cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9640_firmware cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9650_firmware cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9655_firmware cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
qualcomm msm8909w_firmware cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
qualcomm msm8996au_firmware cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
qualcomm qca8081_firmware cpe:2.3:o:qualcomm:qca8081_firmware:-:*:*:*:*:*:*:*
qualcomm qcs405_firmware cpe:2.3:o:qualcomm:qcs405_firmware:-:*:*:*:*:*:*:*
qualcomm qcs605_firmware cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
qualcomm qualcomm_215_firmware cpe:2.3:o:qualcomm:qualcomm_215_firmware:-:*:*:*:*:*:*:*
qualcomm sd_210_firmware cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
qualcomm sd_212_firmware cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
qualcomm sd_205_firmware cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
qualcomm sd_410_firmware cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*
qualcomm sd_412_firmware cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*
qualcomm sd_425_firmware cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
qualcomm sd_427_firmware cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
qualcomm sd_430_firmware cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
qualcomm sd_435_firmware cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
qualcomm sd_439_firmware cpe:2.3:o:qualcomm:sd_439_firmware:-:*:*:*:*:*:*:*
qualcomm sd_429_firmware cpe:2.3:o:qualcomm:sd_429_firmware:-:*:*:*:*:*:*:*
qualcomm sd_450_firmware cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
qualcomm sd_615_firmware cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*
qualcomm sd_616_firmware cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*
qualcomm sd_415_firmware cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*
qualcomm sd_625_firmware cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
qualcomm sd_632_firmware cpe:2.3:o:qualcomm:sd_632_firmware:-:*:*:*:*:*:*:*
qualcomm sd_636_firmware cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*
qualcomm sd_650_firmware cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*
qualcomm sd_652_firmware cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*
qualcomm sd_712_firmware cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:*
qualcomm sd_710_firmware cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:*
qualcomm sd_670_firmware cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:*
qualcomm sd_820_firmware cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
qualcomm sd_820a_firmware cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*
qualcomm sd_835_firmware cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
qualcomm sd_845_firmware cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
qualcomm sd_850_firmware cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*
qualcomm sd_855_firmware cpe:2.3:o:qualcomm:sd_855_firmware:-:*:*:*:*:*:*:*
qualcomm sd_8cx_firmware cpe:2.3:o:qualcomm:sd_8cx_firmware:-:*:*:*:*:*:*:*
qualcomm sda660_firmware cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
qualcomm sdm439_firmware cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
qualcomm sdm630_firmware cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
qualcomm sdm660_firmware cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
qualcomm sdx20_firmware cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:*
qualcomm snapdragon_high_med_2016_firmware cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:*
qualcomm sxr1130_firmware cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*

References for CVE-2018-13906

cvelogic Threat Intelligence