CVE-2018-13909

Metadata verification and partial hash system calls by bootloader may corrupt parallel hashing state in progress resulting in unexpected behavior in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in MDM9206, MDM9607, MDM9650, MDM9655, QCS605, Qualcomm 215, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 712 / SD 710 / SD 670, SD 845 / SD 850, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130

Published: 2019-06-14 Last update: 2026-06-16 Assigner: [email protected] Source: [email protected]
NVD Status：Modified，CVE State: published
View at NVD, CVE.org, EUVD

CVE-2018-13909 is rated Low Risk (29.3/100): CVSS High severity, with low exploitation likelihood (EPSS 0.14%). Monitor for updates and reassess as exploit intelligence or EPSS changes.

Risk is dynamic; we continuously reassess and refresh what is shown on this page as upstream context changes.

Exploit prediction scoring system (EPSS) score for CVE-2018-13909

EPSS lead: Daily EPSS estimates relative likelihood of exploitation; percentile ranks this CVE among scored vulnerabilities (higher = more severe relative rank).

# Date Old EPSS score New EPSS score Delta (New - Old)
1 2026-06-15 0.04% 0.14% +0.09%
2 2023-03-07 0.89% 0.04% -0.84%
3 2022-02-04 — 0.89% —

Full EPSS history (4 records total)

Common vulnerability scoring system (CVSS) metrics for CVE-2018-13909

CVSS metrics for this CVE.

Base score Version Severity Vector Exploitability Impact Score source
7.0 3.0 HIGH
CVSS:3.0/AV:L/AC:H/PR:L/UI:N/S:U/C:H/I:H/A:H Click to expand
Attack vector (AV:L)
They already need access on the box, or another person has to do something wrong; it’s not a remote drive-by.
Attack complexity (AC:H)
Even with access, the exploit needs extra luck, timing, or a fussy environment to actually work.
Privileges required (PR:L)
A normal user session is enough; they don’t have to be admin.
User interaction (UI:N)
Nobody has to click “OK” or open a trap file; it can work without a victim helping.
Scope (S:U)
Damage stays in the same “trust bubble” as the broken component—no big spill into unrelated systems.
Confidentiality (C:H)
Serious risk that confidential data gets exposed in a big way.
Integrity (I:H)
They could widely tamper with or forge data—trust in the data is badly hurt.
Availability (A:H)
Could take the service down hard or make it unusable for people who depend on it.
 1.0 5.9 [email protected]
6.9 2.0 MEDIUM
AV:L/AC:M/Au:N/C:C/I:C/A:C Click to expand
Access vector (AV:L)
Requires local access to the target system.
Access complexity (AC:M)
Exploitation needs some favorable conditions, but not exceptional ones.
Authentication (AU:N)
No authentication is required.
Confidentiality impact (C:C)
Complete confidentiality impact.
Integrity impact (I:C)
Complete integrity impact.
Availability impact (A:C)
Complete availability impact.
 3.4 10.0 [email protected]

Weakness enumeration for CVE-2018-13909

Affected software / configurations for CVE-2018-13909

Vendor Product Version Raw CPE
qualcomm mdm9206_firmware — cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9607_firmware — cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9650_firmware — cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9655_firmware — cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
qualcomm qcs605_firmware — cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
qualcomm qm215_firmware — cpe:2.3:o:qualcomm:qm215_firmware:-:*:*:*:*:*:*:*
qualcomm sd_410_firmware — cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*
qualcomm sd_412_firmware — cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*
qualcomm sd_425_firmware — cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
qualcomm sd_427_firmware — cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
qualcomm sd_430_firmware — cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
qualcomm sd_435_firmware — cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
qualcomm sd_439_firmware — cpe:2.3:o:qualcomm:sd_439_firmware:-:*:*:*:*:*:*:*
qualcomm sd_429_firmware — cpe:2.3:o:qualcomm:sd_429_firmware:-:*:*:*:*:*:*:*
qualcomm sd_450_firmware — cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
qualcomm sd_625_firmware — cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
qualcomm sd_632_firmware — cpe:2.3:o:qualcomm:sd_632_firmware:-:*:*:*:*:*:*:*
qualcomm sd_636_firmware — cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*
qualcomm sd_712_firmware — cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:*
qualcomm sd_710_firmware — cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:*
qualcomm sd_670_firmware — cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:*
qualcomm sd_845_firmware — cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
qualcomm sd_850_firmware — cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*
qualcomm sd_8cx_firmware — cpe:2.3:o:qualcomm:sd_8cx_firmware:-:*:*:*:*:*:*:*
qualcomm sda660_firmware — cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
qualcomm sdm439_firmware — cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
qualcomm sdm630_firmware — cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
qualcomm sdm660_firmware — cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
qualcomm snapdragon_high_med_2016_firmware — cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:*
qualcomm sxr1130_firmware — cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*

References for CVE-2018-13909

cvelogic Threat Intelligence