CVE-2019-14037

Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130

Published: 2020-07-30 Last update: 2026-06-16 Assigner: [email protected] Source: [email protected]
NVD Status：Modified，CVE State: published
View at NVD, CVE.org, EUVD

CVE-2019-14037 is rated Low Risk (34.8/100): CVSS High severity, with low exploitation likelihood (EPSS 0.20%). Monitor for updates and reassess as exploit intelligence or EPSS changes.

Risk is dynamic; we continuously reassess and refresh what is shown on this page as upstream context changes.

Exploit prediction scoring system (EPSS) score for CVE-2019-14037

EPSS lead: Daily EPSS estimates relative likelihood of exploitation; percentile ranks this CVE among scored vulnerabilities (higher = more severe relative rank).

# Date Old EPSS score New EPSS score Delta (New - Old)
1 2026-06-15 0.04% 0.20% +0.15%
2 2026-04-05 0.10% 0.04% -0.05%
3 2025-11-21 — 0.10% —

Full EPSS history (12 records total)

Common vulnerability scoring system (CVSS) metrics for CVE-2019-14037

CVSS metrics for this CVE.

Base score Version Severity Vector Exploitability Impact Score source
7.8 3.1 HIGH
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H Click to expand
Attack vector (AV:L)
They already need access on the box, or another person has to do something wrong; it’s not a remote drive-by.
Attack complexity (AC:L)
Once they can reach the bug, pulling it off is straightforward—no weird race conditions or rare setup.
Privileges required (PR:L)
A normal user session is enough; they don’t have to be admin.
User interaction (UI:N)
Nobody has to click “OK” or open a trap file; it can work without a victim helping.
Scope (S:U)
Damage stays in the same “trust bubble” as the broken component—no big spill into unrelated systems.
Confidentiality (C:H)
Serious risk that confidential data gets exposed in a big way.
Integrity (I:H)
They could widely tamper with or forge data—trust in the data is badly hurt.
Availability (A:H)
Could take the service down hard or make it unusable for people who depend on it.
 1.8 5.9 [email protected]
4.6 2.0 MEDIUM
AV:L/AC:L/Au:N/C:P/I:P/A:P Click to expand
Access vector (AV:L)
Requires local access to the target system.
Access complexity (AC:L)
Exploitation conditions are straightforward and predictable.
Authentication (AU:N)
No authentication is required.
Confidentiality impact (C:P)
Partial confidentiality impact.
Integrity impact (I:P)
Partial integrity impact.
Availability impact (A:P)
Partial availability impact.
 3.9 6.4 [email protected]

Weakness enumeration for CVE-2019-14037

Affected software / configurations for CVE-2019-14037

Vendor Product Version Raw CPE
qualcomm apq8009_firmware — cpe:2.3:o:qualcomm:apq8009_firmware:-:*:*:*:*:*:*:*
qualcomm apq8053_firmware — cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*
qualcomm apq8096au_firmware — cpe:2.3:o:qualcomm:apq8096au_firmware:-:*:*:*:*:*:*:*
qualcomm apq8098_firmware — cpe:2.3:o:qualcomm:apq8098_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9206_firmware — cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9207c_firmware — cpe:2.3:o:qualcomm:mdm9207c_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9607_firmware — cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9640_firmware — cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9650_firmware — cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
qualcomm msm8905_firmware — cpe:2.3:o:qualcomm:msm8905_firmware:-:*:*:*:*:*:*:*
qualcomm msm8909w_firmware — cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
qualcomm msm8996_firmware — cpe:2.3:o:qualcomm:msm8996_firmware:-:*:*:*:*:*:*:*
qualcomm msm8996au_firmware — cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
qualcomm qcn7605_firmware — cpe:2.3:o:qualcomm:qcn7605_firmware:-:*:*:*:*:*:*:*
qualcomm qcn7606_firmware — cpe:2.3:o:qualcomm:qcn7606_firmware:-:*:*:*:*:*:*:*
qualcomm qcs605_firmware — cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
qualcomm sc8180x_firmware — cpe:2.3:o:qualcomm:sc8180x_firmware:-:*:*:*:*:*:*:*
qualcomm sda660_firmware — cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
qualcomm sda845_firmware — cpe:2.3:o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:*
qualcomm sdm439_firmware — cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
qualcomm sdm630_firmware — cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
qualcomm sdm636_firmware — cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*
qualcomm sdm660_firmware — cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
qualcomm sdm670_firmware — cpe:2.3:o:qualcomm:sdm670_firmware:-:*:*:*:*:*:*:*
qualcomm sdm710_firmware — cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*
qualcomm sdm845_firmware — cpe:2.3:o:qualcomm:sdm845_firmware:-:*:*:*:*:*:*:*
qualcomm sdx20_firmware — cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:*
qualcomm sdx24_firmware — cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:*
qualcomm sdx55_firmware — cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
qualcomm sm8150_firmware — cpe:2.3:o:qualcomm:sm8150_firmware:-:*:*:*:*:*:*:*
qualcomm sxr1130_firmware — cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*

References for CVE-2019-14037

cvelogic Threat Intelligence