CVE-2019-2275

While deserializing any key blob during key operations, buffer overflow could occur exposing partial key information if any key operations are invoked(Depends on CVE-2018-13907) in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in MDM9150, MDM9205, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS404, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130

Published: 2019-11-06 Last update: 2024-11-21 Assigner: [email protected] Source: [email protected]

Conclusion & alert: CVE-2019-2275 is rated Low Risk (25/100): CVSS Medium severity, with low exploitation likelihood (EPSS 0.19%). Mandatory action: Monitor for updates and reassess as exploit intelligence or EPSS changes.

Risk is dynamic; we continuously reassess and refresh what is shown on this page as upstream context changes.

Exploit prediction scoring system (EPSS) score for CVE-2019-2275

EPSS lead: Daily EPSS estimates relative likelihood of exploitation; percentile ranks this CVE among scored vulnerabilities (higher = more severe relative rank).

# Date Old EPSS score New EPSS score Delta (New - Old)
1 2026-06-15 0.05% 0.19% +0.14%
2 2025-03-30 0.09% 0.05% -0.05%
3 2025-03-29 0.09%

Full EPSS history (8 records total)

Common vulnerability scoring system (CVSS) metrics for CVE-2019-2275

CVSS metrics for this CVE.

Base score Version Severity Vector Exploitability Impact Score source
5.5 3.1 MEDIUM
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:N Click to expand
Attack vector (AV:L)
They already need access on the box, or another person has to do something wrong; it’s not a remote drive-by.
Attack complexity (AC:L)
Once they can reach the bug, pulling it off is straightforward—no weird race conditions or rare setup.
Privileges required (PR:L)
A normal user session is enough; they don’t have to be admin.
User interaction (UI:N)
Nobody has to click “OK” or open a trap file; it can work without a victim helping.
Scope (S:U)
Damage stays in the same “trust bubble” as the broken component—no big spill into unrelated systems.
Confidentiality (C:H)
Serious risk that confidential data gets exposed in a big way.
Integrity (I:N)
Data isn’t meaningfully altered or forged.
Availability (A:N)
Service keeps running; no real outage angle.
1.8 3.6 [email protected]
2.1 2.0 LOW
AV:L/AC:L/Au:N/C:P/I:N/A:N Click to expand
Access vector (AV:L)
Requires local access to the target system.
Access complexity (AC:L)
Exploitation conditions are straightforward and predictable.
Authentication (AU:N)
No authentication is required.
Confidentiality impact (C:P)
Partial confidentiality impact.
Integrity impact (I:N)
No integrity impact.
Availability impact (A:N)
No availability impact.
3.9 2.9 [email protected]

Weakness enumeration for CVE-2019-2275

Affected software / configurations for CVE-2019-2275

Vendor Product Version Raw CPE
qualcomm mdm9150_firmware cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9205_firmware cpe:2.3:o:qualcomm:mdm9205_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9206_firmware cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9607_firmware cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
qualcomm mdm9650_firmware cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
qualcomm msm8909w_firmware cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
qualcomm msm8996au_firmware cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
qualcomm qcs404_firmware cpe:2.3:o:qualcomm:qcs404_firmware:-:*:*:*:*:*:*:*
qualcomm qcs605_firmware cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
qualcomm qualcomm_215_firmware cpe:2.3:o:qualcomm:qualcomm_215_firmware:-:*:*:*:*:*:*:*
qualcomm sd_210_firmware cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
qualcomm sd_212_firmware cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
qualcomm sd_205_firmware cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
qualcomm sd_410_firmware cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*
qualcomm sd_412_firmware cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*
qualcomm sd_425_firmware cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
qualcomm sd_427_firmware cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
qualcomm sd_430_firmware cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
qualcomm sd_435_firmware cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
qualcomm sd_439_firmware cpe:2.3:o:qualcomm:sd_439_firmware:-:*:*:*:*:*:*:*
qualcomm sd_429_firmware cpe:2.3:o:qualcomm:sd_429_firmware:-:*:*:*:*:*:*:*
qualcomm sd_450_firmware cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
qualcomm sd_625_firmware cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
qualcomm sd_632_firmware cpe:2.3:o:qualcomm:sd_632_firmware:-:*:*:*:*:*:*:*
qualcomm sd_636_firmware cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*
qualcomm sd_650_firmware cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*
qualcomm sd_652_firmware cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*
qualcomm sd_712_firmware cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:*
qualcomm sd_710_firmware cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:*
qualcomm sd_670_firmware cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:*
qualcomm sd_820_firmware cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
qualcomm sd_820a_firmware cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*
qualcomm sd_835_firmware cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
qualcomm sd_845_firmware cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
qualcomm sd_850_firmware cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*
qualcomm sd_855_firmware cpe:2.3:o:qualcomm:sd_855_firmware:-:*:*:*:*:*:*:*
qualcomm sd_8cx_firmware cpe:2.3:o:qualcomm:sd_8cx_firmware:-:*:*:*:*:*:*:*
qualcomm sda660_firmware cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
qualcomm sdm439_firmware cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
qualcomm sdm630_firmware cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
qualcomm sdm660_firmware cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
qualcomm snapdragon_high_med_2016_firmware cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:*
qualcomm sxr1130_firmware cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*

References for CVE-2019-2275

cvelogic Threat Intelligence