CVE-2020-10255

Modern DRAM chips (DDR4 and LPDDR4 after 2015) are affected by a vulnerability in deployment of internal mitigations against RowHammer attacks known as Target Row Refresh (TRR), aka the TRRespass issue. To exploit this vulnerability, the attacker needs to create certain access patterns to trigger bit flips on affected memory modules, aka a Many-sided RowHammer attack. This means that, even when chips advertised as RowHammer-free are used, attackers may still be able to conduct privilege-escalation attacks against the kernel, conduct privilege-escalation attacks against the Sudo binary, and achieve cross-tenant virtual-machine access by corrupting RSA keys. The issue affects chips produced by SK Hynix, Micron, and Samsung. NOTE: tracking DRAM supply-chain issues is not straightforward because a single product model from a single vendor may use DRAM chips from different manufacturers.

Published: 2020-03-10 Last update: 2024-11-21 Assigner: [email protected] Source: [email protected]
NVD Status：Modified，CVE State: published
View at NVD, CVE.org, EUVD

CVE-2020-10255 is rated Moderate Risk (63/100): CVSS Critical severity, with medium exploitation likelihood (EPSS 1.54%). Review affected assets and schedule remediation.

Risk is dynamic; we continuously reassess and refresh what is shown on this page as upstream context changes.

Exploit prediction scoring system (EPSS) score for CVE-2020-10255

EPSS lead: Daily EPSS estimates relative likelihood of exploitation; percentile ranks this CVE among scored vulnerabilities (higher = more severe relative rank).

# Date Old EPSS score New EPSS score Delta (New - Old)
1 2025-11-21 2.78% 1.54% -1.24%
2 2025-11-18 1.54% 2.78% +1.24%
3 2025-04-28 — 1.54% —

Full EPSS history (12 records total)

Common vulnerability scoring system (CVSS) metrics for CVE-2020-10255

CVSS metrics for this CVE.

Base score Version Severity Vector Exploitability Impact Score source
9.0 3.1 CRITICAL
CVSS:3.1/AV:N/AC:H/PR:N/UI:N/S:C/C:H/I:H/A:H Click to expand
Attack vector (AV:N)
Could be attacked over the internet or any normal routed network—not just someone sitting at the machine.
Attack complexity (AC:H)
Even with access, the exploit needs extra luck, timing, or a fussy environment to actually work.
Privileges required (PR:N)
No account or special rights needed—anonymous or random user is enough.
User interaction (UI:N)
Nobody has to click “OK” or open a trap file; it can work without a victim helping.
Scope (S:C)
Breaking this can reach past the original component and bite other resources—bigger blast radius.
Confidentiality (C:H)
Serious risk that confidential data gets exposed in a big way.
Integrity (I:H)
They could widely tamper with or forge data—trust in the data is badly hurt.
Availability (A:H)
Could take the service down hard or make it unusable for people who depend on it.
 2.2 6.0 [email protected]
9.3 2.0 HIGH
AV:N/AC:M/Au:N/C:C/I:C/A:C Click to expand
Access vector (AV:N)
Can be exploited remotely over network reachability.
Access complexity (AC:M)
Exploitation needs some favorable conditions, but not exceptional ones.
Authentication (AU:N)
No authentication is required.
Confidentiality impact (C:C)
Complete confidentiality impact.
Integrity impact (I:C)
Complete integrity impact.
Availability impact (A:C)
Complete availability impact.
 8.6 10.0 [email protected]

Weakness enumeration for CVE-2020-10255

OS Trackers for CVE-2020-10255

vendor priority summary link
redhat high — https://access.redhat.com/security/cve/CVE-2020-10255

Affected software / configurations for CVE-2020-10255

Vendor Product Version Raw CPE
micron ddr4_sdram — cpe:2.3:h:micron:ddr4_sdram:-:*:*:*:*:*:*:*
micron lpddr4 — cpe:2.3:h:micron:lpddr4:-:*:*:*:*:*:*:*
samsung ddr4 — cpe:2.3:h:samsung:ddr4:-:*:*:*:*:*:*:*
samsung lpddr4 — cpe:2.3:h:samsung:lpddr4:-:*:*:*:*:*:*:*
skhynix ddr4_sdram — cpe:2.3:h:skhynix:ddr4_sdram:-:*:*:*:*:*:*:*
skhynix lpddr4 — cpe:2.3:h:skhynix:lpddr4:-:*:*:*:*:*:*:*

References for CVE-2020-10255

cvelogic Threat Intelligence