On some hardware revisions where VP9 decoding is hardware-accelerated, the frame size is not programmed correctly into the decoder hardware which can lead to an invalid memory access by the decoder.
結論預警: CVE-2017-11076 綜合評估為中等風險（57.3/100）：CVSS 技術影響為嚴重級，利用機率（EPSS 0.28%） 強制指令: 梳理受影響資產並納入修補計畫。
風險隨態勢動態變化；本站持續評估並同步更新本頁展示內容。
EPSS 日更估計相對被利用可能性；百分位表示該 CVE 在已評分漏洞中的相對排名（越高表示相對更嚴重）。
| # | 日期 | 舊 EPSS 分數 | 新 EPSS 分數 | 變化（新 − 舊） |
|---|---|---|---|---|
| 1 | 2026-04-17 | 0.21% | 0.28% | +0.08% |
| 2 | 2026-01-05 | 0.27% | 0.21% | -0.06% |
| 3 | 2026-01-04 | — | 0.27% | — |
完整 EPSS 歷史 （共 7 筆）
該 CVE 的 CVSS 指標。
| 底座分 | 版本 | 嚴重度 | 向量 | 可利用性 | 影響 | 分數來源 |
|---|---|---|---|---|---|---|
| 9.8 | 3.1 | CRITICAL |
|
3.9 | 5.9 | [email protected] |
| 廠商 | 產品 | 版本 | 原始 CPE |
|---|---|---|---|
| qualcomm | msm8909w_firmware | — | cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:* |
| qualcomm | msm8996au_firmware | — | cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_210_firmware | — | cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_212_firmware | — | cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_205_firmware | — | cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_425_firmware | — | cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_427_firmware | — | cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_430_firmware | — | cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_435_firmware | — | cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_450_firmware | — | cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_615_firmware | — | cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_616_firmware | — | cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_415_firmware | — | cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_625_firmware | — | cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_810_firmware | — | cpe:2.3:o:qualcomm:sd_810_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_820_firmware | — | cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_820a_firmware | — | cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_835_firmware | — | cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sd_845_firmware | — | cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sdm429_firmware | — | cpe:2.3:o:qualcomm:sdm429_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sdm439_firmware | — | cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sdm630_firmware | — | cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sdm632_firmware | — | cpe:2.3:o:qualcomm:sdm632_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sdm636_firmware | — | cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sdm660_firmware | — | cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:* |
| qualcomm | sdm710_firmware | — | cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:* |
| qualcomm | snapdragon_high_med_2016_firmware | — | cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:* |
| URL | 標籤 |
|---|---|
| https://docs.qualcomm.com/product/publicresources/securitybulletin/may-2018-bulletin.html | Vendor Advisory |